產品描述
電子資訊工業近幾年來在中國的迅速發展下，結合各種相關產業，已經成為中國蓬勃發展、舉足輕重的新興產業。
江蘇諾德正是藉此信息產業化發展之平臺，以專業制造電子基礎材料為優勢，于2007年開始建立銅箔基板生產基地，憑借優秀的科技人才與創新的研發能力，配套發展生產通訊設備、數碼家電、電腦等產品之主要電子基礎材料：銅箔基板，提供給客戶滿意的產品選擇與售后服務。
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Aluminum Base CCL |
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特點
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應用領域 |
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FEATURES
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APPLICATIONS |
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GENERAL PROPERTIES |
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Test Item |
Test condition |
Units |
Typical value |
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Peel Strength , LBS/IN,Minimum,1 OZ |
288℃/10sec |
LBS/IN |
11.7 |
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Volume resistivity ,Minimum |
E-24/125 |
MΩ.cm |
≥108 |
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Surface resistivity , Minimum |
E-24/125 |
MΩ |
≥108 |
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Thermal Stress |
288℃,solder dip |
Min |
10 |
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288℃,solder float |
Min |
30 |
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Dielectric Breakdown, Minimum |
D-48/50 D-0.5/23 |
Kv |
6.0 |
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Thermal Conductivity |
Dielectric layer |
ASTM D5470 |
W/(m﹒K) |
2.0 |
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Thermal Resistance |
K﹒cm2/W |
0.57 |
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Dielectric Constant |
C-24/23/50,1MHz |
- |
5.3 |
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C-24/23/50,1GHz |
- |
5.1 |
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Dissipation Factor |
C-24/23/50,1MHz |
- |
0.022 |
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C-24/23/50,1GHz |
- |
0.018 |
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CTI |
IEC60112 Method |
V |
200 |
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Flammability |
UL-94 |
- |
V-0 |
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Glass Transition Temperature |
DSC |
℃ |
140 |
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CTE(Z-axis) |
Before Tg |
TMA |
ppm/℃ |
27 |
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Decomposition Temperature(Td) |
TGA(5% Weight Loss) |
℃ |
390 |
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Note: |
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Peel strength Reliability
※Specimen T hickness:1.6mm single side board
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PURCHASING INFORMATION |
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Material |
Type |
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Cu |
E/D Cu |
HOZ、1OZ、2OZ |
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Dielectric Layer |
Epoxy resin filled with inorganic filler |
75μm-120μm |
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Base Metal Plate |
1060 Al |
0.3mm-3.0mm |
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1100 Al |
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3003 Al |
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5052 Al |
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Masking Film |
PET/PI Film |
2.5mil |
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Standard Size |
914mm×1219mm（36＂×48＂）；1016mm×1219mm（40＂×48＂）1000mm×1200mm； 500mm×600mm |
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※ Other sheet size and thickness could be available upon request. |
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合作意向表
Cooperation Intent Form
